FS-RT300
- Typical time for wafer map: 90 seconds
(49 points on a 300 mm diameter wafer) - Compact footprint: 400×500 mm, 22 kg
- Stage travel: R (linear) 150 mm, resolution: 12 μm
Theta (rotation) 360°, resolution: 0.1°
Features and Specifications
- 4 wavelengths of ellipsometric data
(465, 525, 580, 635 nm), with long life
LED sources, and no moving parts detector - Accurate thickness measurements for most
transparent thin films from 0 – 1000 nm - Typical thickness repeatability: 0.015 nm
- Integrated focusing probes,
standard spot size: 0.8 x 1.9 mm
(other spot sizes available) - Motorized Z-stage for sample auto-alignment
- Flexible Scan Pattern Editor
- Contour plots of measured parameters
Easy-to-Use Software
