OSA Reviewer

FS-RT300

Typical time for wafer map: 90 seconds
(49 points on a 300 mm diameter wafer)
Compact footprint: 400×500 mm, 22 kg
Stage travel: R (linear) 150 mm, resolution: 12 μm
Theta (rotation) 360°, resolution: 0.1°

4 wavelengths of ellipsometric data
(465, 525, 580, 635 nm), with long life
LED sources, and no moving parts detector
Accurate thickness measurements for most
transparent thin films from 0 – 1000 nm
Typical thickness repeatability: 0.015 nm
Integrated focusing probes,
standard spot size: 0.8 x 1.9 mm
(other spot sizes available)
Motorized Z-stage for sample auto-alignment
Flexible Scan Pattern Editor
Contour plots of measured parameters

.click on picture to reach video demo for RT150

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SNOWRAY

SNOWRAY: A very nice step into future for industry quality control

From what we learned before...

Even though being far away...

Meta materials.. Polarimetry Mueller matrices Surface Analysis but what else??

e.g. with the Film Sense powerfull Instrument ... the RT300 from Film Sense 60seconds for only 49 points

or slower with other systems...

classical Mapping obtained with XY SE Mapping...2D acquisition takes a very long time isn't? Even with only 49 points

with 3D results SNOWRAY looks like that : Immediate picture!!! .If you get many data...

Is that a new way? ...Let's consider Plank 's law and Material Emissivity

Irradiated multi layers sample gives a unique signature

In the Infra Red related to respective material nature and respective layers stacks thicknesses

the IR Emissivity versus thickness can be thus calibrated.....provide then absolute thickness values..

with the SNOWRAY technique .. that's what we get

another wafer patented mapping technique

instantaneous measurement.compareto classical XY mapping..!!

A deep into wafer structure

with powerfull analysis since..for one detail..

One can focus on specific 3D defects detected ...

when setup with In situ Ellipsometer with very fast acquisition rate (10ms)...

Collaboration in Beta sites is opened worlwide ...

A new instrument a full real time thickness calibration .