From what we learned before...
Even though being far away...
Meta materials.. Polarimetry Mueller matrices Surface Analysis but what else??
e.g. with the Film Sense powerfull Instrument ... the RT300 from Film Sense 60seconds for only 49 points
or slower with other systems...
classical Mapping obtained with XY SE Mapping...2D acquisition takes a very long time isn't? Even with only 49 points
with 3D results SNOWRAY looks like that : Immediate picture!!! .If you get many data...
Is that a new way? ...Let's consider Plank 's law and Material Emissivity
In the Infra Red related to respective material nature and respective layers stacks thicknesses
with the SNOWRAY technique .. that's what we get
another wafer patented mapping technique
A deep into wafer structure
when setup with In situ Ellipsometer with very fast acquisition rate (10ms)...
which provides an absolute real time calibration ...
Collaboration in Beta sites is opened worlwide ...
A new instrument a full real time thickness calibration .
Ag layer model (Francoeur et al 2013 JRT 75-85.)
and what can be evaluated....

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Polarimetry of Surfaces (1)

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SNOWRAY
SNOWRAY: A very nice step into future for industry quality control
From what we learned before...
Even though being far away...
Meta materials.. Polarimetry Mueller matrices Surface Analysis but what else??
e.g. with the Film Sense powerfull Instrument ... the RT300 from Film Sense 60seconds for only 49 points
or slower with other systems...
classical Mapping obtained with XY SE Mapping...2D acquisition takes a very long time isn't? Even with only 49 points
with 3D results SNOWRAY looks like that : Immediate picture!!! .If you get many data...
Is that a new way? ...Let's consider Plank 's law and Material Emissivity
Irradiated multi layers sample gives a unique signature
In the Infra Red related to respective material nature and respective layers stacks thicknesses
the IR Emissivity versus thickness can be thus calibrated.....provide then absolute thickness values..
with the SNOWRAY technique .. that's what we get
another wafer patented mapping technique
instantaneous measurement.compareto classical XY mapping..!!
A deep into wafer structure
with powerfull analysis since..for one detail..
One can focus on specific 3D defects detected ...
when setup with In situ Ellipsometer with very fast acquisition rate (10ms)...
Collaboration in Beta sites is opened worlwide ...
A new instrument a full real time thickness calibration .

French and European Patents documents
 
 
 
EPJCPonçot PTsFrance2014fr
  logo pdf
 
 
 
 EP 2 957 857 A2
(12) DEMANDE DE BREVET EUROPEEN
(43) Date de publication:
23.12.2015 Bulletin 2015/52
(21) Numéro de dépôt: 15172151.1
(22) Date de dépôt: 15.06.2015
(51) Int Cl.:
G01B 11/06 (2006.01) G01B 21/08 (2006.01)
(84) Etats contractants désignés:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB
GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO
PL PT RO RS SE SI SK SM TR
Etats d’extension désignés:
BA ME
Etats de validation désignés:
MA: 19.06.2014 FR 1455650
) Demandeur: Ponçot, Jan-Claude
25000 Besancon (FR)
(72) Inventeur: PONÇOT, Jean-Claude
25000 BESANÇON (FR)
 DISPOSITIF DE MESURE D’UN ENSEMBLE DE DONNEES SPATIALES D’EPAISSEUR D(X,Y)
D’UNE COUCHE MINCE ET PROCEDE DE MESURE UTILISANT LEDIT DISPOSITIF
(57) L’invention a pour objet un dispositif de mesure
d’un ensemble de données spatiales d’épaisseur d(x,y)
d’une couche mince comprise dans un ensemble de couche(

EP 2 957 857 A2
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